IPC-2581 B1 is in official review process

The IPC-2581 Revision B was passed in fall of 2014. During the adoption of revision B, members identified a few areas that needed additional clarification to avoid multiple iterations of the same element(s). The IPC-2581 consortium’s technical team identified the areas that can potentially be mis-interpreted and came up with an update to revision B and is being called revision B1.

The IPC-2581 rev B1 has just entered its second official review phase following the IPC standards revision policies. Providing there are no major issues found, the next step is to approve the 2581 B1 version by official ballot.


Revision B1 updates include.

  • More material description types used in the creation of printed wiring boards
  • More robust function table, where specific data is targeted to different processes
  • Clarification of schema details were also introduced to better describe data sets and reduce interpretation differences 
  • The function table was also overhauled to improve data requirements for specific steps in the fabrication process that will in turn reduce data clutter and protect company intellectual property.

Research is under way to expand 2581 to include external references, processes for augmentation of data provided by fabrication, assembly, test, and field support. Validation tools are also a general focus to ensure tool providers are following proper protocol which will fall into a certification process. Support for various design technologies such as Rigid-Flex, packaging, and 3D descriptions are also on the table for inclusion into the next revision of IPC-2581.


 



 

 


 

IPC-2581 Consortium at PCB West 2015

As we have previously stated in our “PCB West 2015” article, the IPC-2581 Consortium will be attending PCB West 2015! Visit us at Booth 610 to speak with a representative of the IPC-2581 Consortium, where we will demonstrate the input and export of IPC-2581 from different tools. The IPC-2581 Consortium will also be hosting a Free Design Session, “An Update on Design Data Transfer Using IPC-2581.” Hemant Shah of Cadence Design Systems on behalf of the Consortium will be presenting on Wednesday, September 16th, from 10:00 AM to 11:00 AM.

Read More: IPC-2581 Consortium at PCB West 2015



 

 

IPC-2581 B1 Update

The 2-16 Product Data Description (Laminar View) Subcommittee (IPC-2581) met in February during the IPC APEX Expo in San Diego CA. At this meeting final details for amendments and document updates as well as slight Schema modifications were addressed. The main focus of the meeting was to focus on an amendment of IPC-2581 Revision B to IPC-2581 Revision B1.  

As part of the B1 modification, more descriptions, enumerated type and qualified string enhancements were made to enable adoption of 2581 Revision B without any structural changes to the schema. Examples for enhancements include, but are not limited to items such as more layer use type descriptions (flex type materials, masks, etc.), additional properties for parts and stack-up objects. The IPC-2581 Schema Document was also updated to record the new enhancements, correct spelling, and updated items overlooked between the schema and the document.

Read More: IPC-2581 B1 Update



 

IPC-2581 is Rapidly Gaining Support In the PCB Design Community

IPC-2581 is rapidly gaining support in the PCB design community as an "intelligent," vendor-neutral format that can bring design data into manufacturing in a single file. The PCB West conference in Santa Clara, California on Sept. 10, 2014 provided an update on this fast-moving standard and the IPC-2581 Consortium that is driving it.

Read more: PCB West 2014: IPC-2581 Data Transfer Format Links Design, Manufacturing