Come visit us at IPC APEX 2019

January 17, 2019

At this year’s APEX show we will explore new opportunities to expand the format. There will be user group and committtee meetings and a Buzz Session at this year’s APEX event. Be sure not to miss it.

How IPC-2581 Enables Industry 4.0

Tuesday, Jan 29 — 3:30 PM to 5:00 PM | Buzz Session 2

Come listen to industry experts talk about how IPC-2581 works with the IPC-CFX (Connected Factory eXchange) standard to enable smooth integration of design and manufacturing process. Topics covered in this buzz session are:

• What is Industry 4.0
• What is IPC-CFX (digital process model)
• How does IPC-2581 (digital product model) fit in
• Who is using IPC-2581
• The benefits of using IPC-2581 (why IPC-2581)
• How to embark on the IPC-2581 journey


• Michael Ford, Aegis Software
• Gary Carter, ThingWeaver Solutions, LLC
• Hemant Shah, Cadence Design Systems Inc.
• Terry Hoffman, Cisco Systems Inc.

Get involved by attending any or all of these important meetings taking place during the APEX conference:

Technical Committee: Support for Fujiko Embedded Features

Monday, Jan 28 — 3:00PM | Room 12

IEC and IPC are collaborating to enhance IPC-2581 to support capabilities supported in Fujiko standard. Fujiko standard is used by many Japanese PCB, IC packaging design and supply chain companies. This is the 3rd in a series of meetings between IEC and the IPC-2581 Consortium to continue the discussion on strategy to support Fujiko constructs in the IPC-2581 standard.

IPC-2581 User Group Meeting

Wednesday, January 30 — 7:30AM-9:00AM | Room 5

The IPC-2581 standard has proven to be very successful. Now it’s time to review some of our recent success stories while considering adoption challenges and future needs. In this meeting, we’ll also continue to discuss support for Circuit Data content for RFQ Specification and Fujiko constructs.

IPC-2581 (2-16) Subcommittee Meeting

Wednesday January 30 — 9:00AM-12:00AM | Room 5

Review proposals and explore model and schema support for GD&T, package descriptions and footprints, holes/via fill, DFX methodologies, and others as we define Revision C.